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Automotive RA Service
Scope of Verification for Automotive Electronic Components |
Automotive electronic components mainly follow the verification standards established by the Automotive Electronics Council (AEC). There are six standards, including the AEC-Q100 (Integrated Circuits), the AEC-Q101 (Discrete Semiconductors), the AEC-Q102 (Optoelectronic Semiconductors), the AEC-Q103 (MEMS Devices), the AEC-Q104 (Multichip Module) and the AEC-Q200 (Passive Components).
The AEC was founded in America by Chrysler, Ford, and General Motors (GM) in 1994. Now members include major auto makers all around the world as well as automotive electronics and semiconductor manufacturers. At first glance, the specifications for automotive electronics seem stricter than those for other components. However, in truth, these verifications still use common international standards such as the JEDEC and the MIL-STD as their main reference with some additional specifications such as IC Electromagnetic Compatibility (IC EMC), integrated circuit board reliability, etc.
The Verification Process for Automotive Electronic Components |
The vehicle verification process includes Die Design, Wafer Manufacturing, component packaging, electrical testing and reliability testing, etc. Each stage has its own rigorous verification specifications. The table below shows the active component AEC-Q100 verification process.
Application
- Auto 3D image capture
- In-situ 3D dimension measurement
- In-situ imaging in multipole angles
- 50-5000 X HDR high-resolution image
- Can be used in various materials analysis including microelectronics/PCBA/semiconductor etc.
- IC dimension measurement
Electrical Property Measurement
Technical Concept |
This technology is used to identify the electrical characteristics, such as resistance, capacitance, and inductance of semiconductor devices. Characteristics measured from fail and normal chips could provide important clues for further failure analysis.
The Verification Process for Automotive Electronic Components
The vehicle verification process includes Die Design, Wafer Manufacturing, component packaging, electrical testing and reliability testing, etc. Each stage has its own rigorous verification specifications. The table below shows the active component AEC-Q100 verification process.
UV-OM
Technical Concept |
Florescence penetration experiments are used mainly on small samples to examine things such as chip-level packaging. This analytical method was derived from the red dye penetration test, which is more suitable for the examination of larger components. For instance, red dye penetration test can be used to observe the condition of the welding on components.
However, when the samples are smaller, the penetration of the red dye becomes increasingly difficult to distinguish beneath the microscope. In contrast, even in small amounts, the florescent agent will emit a light that is distinct from that of the background when irradiated with UV light. Therefore, we can replace red dye with a fluorescent agent when observing the gaps in the welded joints of a sample.
